Senior Advanced Packaging & Reliability Engineer

Smart High Tech is a Swedish DeepTech company developing advanced graphene-enhanced Thermal Interface Materials (TIM) for next-generation AI, semiconductors, high-performance computing, data centres and advanced electronics.

As semiconductor performance and power density continue to increase, advanced packaging, thermal management and long-term reliability are becoming increasingly critical.

We are now strengthening our R&D team with a Senior Advanced Packaging & Reliability Engineer who wants to help solve these challenges and contribute to the next generation of semiconductor technology.

As Senior Advanced Packaging & Reliability Engineer, you will work at the intersection of advanced packaging, materials science, thermal management and reliability engineering.

You will help us understand how our materials and interfaces perform within advanced semiconductor packaging environments by combining simulation, experimental testing, reliability assessment and failure analysis.

You will work closely with our R&D, engineering and product development teams as well as international customers, research institutes and technology partners.

• Evaluate materials and interfaces for advanced semiconductor packaging applications.

• Work with technologies such as 2.5D/3D integration, heterogeneous integration, flip-chip and wafer-level packaging.

• Develop and perform reliability assessments and testing.

• Investigate thermal, mechanical and interfacial failure mechanisms.

• Conduct failure analysis and root-cause investigations.

• Perform thermo-mechanical modelling and finite element analysis.

• Model stresses, deformation and failure mechanisms in packaging structures and interfaces.

• Correlate simulation results with experimental data.

• Use simulation and testing to support material and product optimisation.

• Support the development and qualification of new materials and products.

• Translate technical findings into practical engineering improvements.

• Contribute to customer qualification and technical development projects.

• Collaborate with universities, research institutes, laboratories and international technology partners.

• MSc or PhD in Electronic Packaging, Microelectronics, Materials Science, Mechanical Engineering, Applied Mechanics or a related field.

• Experience in semiconductor packaging and/or power electronics packaging.

• Strong understanding of advanced packaging technologies, materials and interfaces.

• Experience in reliability engineering and/or failure analysis.

• Experience with thermo-mechanical modelling and finite element analysis.

• Familiarity with ANSYS, Abaqus and/or COMSOL.

• Strong analytical and problem-solving capabilities.

• Fluent English, written and spoken.

• A PhD within a relevant technical discipline.

• Experience with 2.5D/3D integration, heterogeneous integration, WLCSP, flip-chip or advanced interconnects.

• Knowledge of solder joints, Cu-based interconnects, sintered materials, microbumps or bonding technologies.

• Experience with electromigration, thermal fatigue, creep, fracture or interfacial reliability.

• Experience with SEM, TEM, FIB or similar characterisation techniques.

• Experience from leading semiconductor companies, packaging companies or research institutes such as IMEC, Fraunhofer, Max Planck, NXP, Nexperia, Infineon, STMicroelectronics, Intel, TSMC, ASE or Amkor.

• Publications or patents within advanced packaging, interconnect technologies or reliability.

You're technically curious, analytical and motivated by solving complex engineering challenges.

You're comfortable moving between simulation, experimental testing and physical analysis and can translate scientific findings into practical engineering solutions.

You enjoy working collaboratively in an international DeepTech environment where research, engineering and industrialisation come together.

At Smart High Tech, you'll work with advanced graphene materials and thermal management technologies addressing one of the fundamental challenges facing next-generation computing: heat.

You'll work alongside experienced researchers and engineers and collaborate with international technology partners and customers.

This is an opportunity to combine deep scientific expertise with real-world industrial impact and contribute directly to our journey from advanced R&D towards industrialisation and global scale.

If you have experience in advanced semiconductor packaging and reliability engineering and want to contribute to the next generation of thermal management technology, we'd like to hear from you.

Apply today. Applications are reviewed continuously.

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